Capabilities

Overview. Tabtronics, Inc. is a “build to print”, contract assembly business specializing in the assembly of circuit boards, custom cable assemblies and control panel instrumentation fabrication and assembly. 

Surface mount technology capabilities include:

• State-of-the-art, automated pick and place equipment
• Capability to handle BGA’s (ball grid array) and 01005 components.
• High density BGA prototyping & reworking
• In-house X-ray capability for placement verification.
• Utilization of 3D paste measuring for process verification. 
• Automated Optical Inspection equipment used for inspection of circuit board assemblies. 
• Selective Soldering capabilities in house.
• All methods of circuit board de-panelizing including:
  
  
  • V-Cut Method
  • Notching Method
  • Router Method

Processes

• 01005 Placement
• Circuit board assembly and test
• Thru-hole, SMT & Fine Pitch
• Lead-Free Approved Manufacturing Process
• Cable Harness assembly and test
• Box build assembly
• Complete product build (box build), test and packaging.
• In-House X-Ray
• Selective soldering
• Deionized water cleaning system which monitoring rinse cleanliness until complete
• Automated optical inspection.
• Conformal coating and potting
• 3-D solder paste height measuring
• Ultrasonic stencil cleaning
• Encapsulation potting and conformal coating

Facility / Company

• 9,000 square feet — With 20,000 sf option
• Two complete SMT lines. Our newest line is capable of placing 01005 components including .4 mm pitch x 42 mm square BGA’s . Max board size:15” W X 18” L; Tallest component: .5”.
• ISO-9001-2008 registered
• Other quality certifications
• About our company

Equipment List

• Manual pick and place prototype machine which uses CAD data for positioning to enable us to build quickly and accurately.
• Samsung Precision Placer capable of placing 01005 to 55mm square and up to 72mm SMT connectors. Placement speeds up to 21,000 CPH (IPC9850)
• Tyco – Mirae Chip Shooter, 30,000 cph capacity, (0201 –TSOP) (16 heads)
• Tyco QSPII Plus 14,000 cph placement speed, 0603 – QFP208
• Min/Max array size 3.2” X 3”/15” X 18”
• Upward vision for BGA, .3mm pitch
• Micro BGA rework Station
• 90KVA, X-Ray inspection machine
• Three dimension solder paste measurement machine
• Ultra-Sonic stencil cleaning machine
• Selective soldering system which increases quality and dramatically decreases process time for assembly that can’t be wave soldered
• Two DEK screen printers with vision
• BTU 7 Zone Lead/Lead Free Reflow Oven
• BTU 10 Zone Nitrogen ready Lead/Free Reflow Oven
• Automated Optical Inspection machine
• Vitronics/Soltec Delta Max Wave Soldering Machine
• 24” Finger Conveyor
• Chip Wave, Smart Wave, Main Wave
• Royonic semi-automatic through hole assembly machine
• Aqueous Technologies resistance monitored board cleaners
• Tyco — Smart Router
• Schleuniger automatic wire cutting and stripping machine
• General Production Devices Lead Former
• AMP G-Press
• Molex TM 40 Press

Call us: 937.222.9969

Online Quote form

CAD Prototyping Machine

One of our newest pieces of equipment allows us to build prototypes manually using CAD data for parts placement. We can build your prototype faster with more accuracy and simulate the production process by reflowing the whole board through the oven instead of tacking the components down - counter to the way prototyping is usually done.

Assembly Line

This is one of our state-of-the-art assembly lines.

Automatic Stencil Cleaning

Our automatic stencil cleaning machines allows us to clean aperatures with ultrasonic vibration assuring no solder paste is left behind in the aperatures.

Ball Grid Array Inspection

Quality control includes in-house ball grid array inspections using this powerful 90 kVA X-Ray.

Selective Soldering

Selective soldering enhances both speed and quality of secondary operations — saving you money.

High-Speed Router

For higher volume production, we utilize our high-speed router for de-panelization where components are very close to the edge of the board and no burrs are allowed.

3D Solder Paste Inspection

This is the first and most important part of the assembly process. The 3D solder past inspection insures the circuit board is supported properly and the screen printer is functioning correctly.