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Product Type
Through Hole Surface Mounting Mixed Assemblies Fine Pitch Components One Side Components Two Sides Chip-on-Board
Through Hole Surface Mounting Mixed Assemblies Fine Pitch Components One Side Components Two Sides Chip-on-board
Backplanes Cable Harnesses Connector Assemblies Hybrids
Assembly Type
Circular Connector 'D' Connector Flat Ribbon Connector Hybrids
UL Requirement STD Industrial FDA, GMP Required
Types of Assembly Operation
Consignment Data Requirements Turnkey Data Requirements
Prototype Medium Volume
High Volume Complete Product Assembly
Facility Requirements
Aqueous Cleaning Functional Testing Automated Incircuit Test Cable Harnesses Conformal Coating
Hand Soldering Hot Air Reflow Infrared Reflow Wave Soldering
Assembly Requirements
Through Hole
Surface Mount
Discrete Components (2 leaded) Discrete Components (3+ leaded) Dual-in-lines (<48 pins) Dual-in-lines (48+ pins) Pin-grid Arrays Electronic Multileaded Components
Standard Chip Components Cylindrical Components (MELFs) SOTs SOICs SQFPs Quad-packs - Gull Wing Quad-packs - J Lead TSOPs Tape Automated Bonding Ball or Land Grid Array Chip Scale Packages Bare Chip (wire bonding) Flip Chip
Fine Pitch Automated Assemblies
0.5 mm Pitch (0.020")
0.4 mm Pitch (0.015")
0.3 mm Pitch (0.012")
0.25 mm Pitch (0.010")
Design Capabilities
Custom Circuit Design
P.C.B. Layout
Packaging
Facility Approval
ISO 9001, 9002 QS-9000 MIL Spec
UL/SCA Bellcore FDA GMP Compliant
Industry Standard
Other Services
Assembly Burn-in System Build
Rework Repair Depot
Testing (apart from assembly)
Packaging & Shipping Requirements
Direct Shipping to Customer/Distributor Bulk Packaging Individual Packaging
Billing Services
Invoice Direct to OEM Invoice Direct to Customer/Distributor
Comments, Requests, and Special Requirements:
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